Miniaturization is Enabled by BGA Substrates

BGA or ball grid array substrates are widely used in the packaging of ICs, ASICs, GPUs, and other multifaceted parts. By allowing a high number of contacts in a limited space it facilitates miniaturization and performance improvements across most forms of electronics. It is important to note, however, that the design of products using and the manufacturing of PBGA package substrate involves fairly complex knowledge.